The Primo nanova® tool is AMEC’s advanced 300mm etch product based on Inductively Coupled Plasma (ICP) technology. It is a cluster tool which can be configured with up to six chambers and two optional on-board integrated strip chambers. The chamber is symmetrical in design with high flow conductance. The ICP coils employ AMEC’s proprietary low capacitive coupling 3D coil design which enables more independent ion density and ion energy control. The chamber interior is coated with high-density plasma-resistant material for greater process repeatability and productivity. For wafer CD uniformity control, there is a high dynamic range multi-zone direct temperature-controlled ESC (electrostatic chuck). The product is intended for 1x or beyond etch applications for logic and memory devices.
Innovative etch solution for logic and DRAM devices at 1x and beyond
Truly symmetric chamber design
Low capacitive coupling 3D coil design
High pumping speed with large capacity turbo pump (TMP)
Precise chamber wall temperature control
Advanced plasma-resistant interior coating
Multi-zone temperature-controlled ESC
Active impedance tuned focus ring design
Switchable dual frequency RF biasing
Integrated dual strippers
Durga ESC ready for selecting
More independent ion energy and ion density controllability
Higher pumping conductance for wider process window
Excellent etch uniformity
Superior profile control for high aspect ratio application
High productivity p
