Launched the wafer bevel etch equipment - Primo Halona™

Shipped 5000h etch station successfully

AMEC 20th Anniversary Grand Event & AMEC Lingang Base opening ceremony

Launched Preforma Uniflex® HW and Preforma Uniflex® AW

Shipped 3000h CCP etch station successfully

AMEC  Guangzhou Opening Ceremony​

500h Chamber shipment milestone of Primo nanova®

The opening ceremony of AMEC Nanchang was held

Launched Preforma Uniflex™CW systemfor 12-inch CVD deposition equippments

Shipped 500th MOCVD chamber successfully

Launched PRISMO PD5® MOCVD system for GaN Power Device production

Shipped 2000h CCP etch station successfully

8-inch ICP etch product developed successfully

Shipped 1500th CCP etch station successfully

AMEC completed a seasoned equity offering, raising 8.2 billion in total

Launched Prismo UniMax® MOCVD system for advanced display application with high-volume Mini LED production

Shipped first 8-inch CCP etch product Primo AD-RIE 200™ successfully

AMEC's project was jointly signed with other key projects at the launch ceremony of the "Oriental ChiPort", a comprehensive industrial base of integreated circuit at Lingang Special Area, Shanghai

Launched Prismo HiT3® MOCVD system for deep UV LED mass production

Became one of the 1st batch of public companies for SSE STAR Market

Excelled in Customer Satisfaction Survey by VLSIresearch and earned 5 VLSI Star Ratings in the 2019 10 BEST

Completed shareholding reform

Achieved the 3rd place in THE BEST Suppliers of Fab Equipment in the 2018 Customer Satisfaction Survey (CSS) conducted annually by leading US market research firm, VLSIresearch, and became the only China-based company to be recognized in the list of winne

100-chamber shipment milestone for the Prismo A7® MOCVD system

Deployed by the leading foundry for its 7nm etch process

1st twin-station ICP etch product developed successfully

Shipped first single-station ICP etch product to major foundry

Shipped first 7nm dielectric etch product to major foundry; subsequently qualified to run production for critical FEOL etch production

Shipped first 2nd-generation MOCVD product to customer

Shipped first VOC product to customer

Shipped first 14nm dielectric etch product to key memory fab; subsequently qualified to run 2D NAND flash production for critical contact etch

CICIIF (China Integrated Circuit Industry Investment Fund Co. Ltd.), AMEC, and Suzhou Juyuan Dongfang Investment Fund (Limited Partnership) invested in Piotech

Installed base milestone of 400 process units

Sole vendor identified as "providing an indigenous Chinese manufacturing capability" in landmark BIS decision to "Remove International Export Controls on Dry Etching Equipment to China"

Became the first equipment company to receive an investment by the Sino IC National Fund following the launch of China's national guidelines for the development and promotion of the IC industry

Shipped first 22nm dielectric etch product to key memory fab, subsequently qualified to run 2D NAND flash production for critical contact etch

Shipped first MOCVD product to customer

Debuted 22,000sqm phase II building in Jinqiao, Shanghai

Shipped first 45nm dielectric etch product to major foundry, subsequently qualified to run production for passivation and via applications

Shipped first TSV/MEMS/Plasma Dicing product to customer

Selected to undertake "National Science and Technology Major Project"

Shipped first CCP etch product to customer

Debuted corporate headquarters in Jinqiao, Shanghai 6,500sqm phase I building architected to house business, R&D and manufacturing operations

Founded in Zhangjiang High-Tech Park, Shanghai