Provide innovative etching solutions for 26 to 10 nm chip manufacturing
Dedicated gas delivery and pumping for each processing station
Multi-zone gas tuning and dual-zone ESC temperature control
High pumping conductance with large capacity turbo pump
Synchronized dual-level RF pulsing (bias and source) system
Cooled focus ring process kit option for extreme-edge wafer CD control
High upper/lower electrode area ratio for high aspect ratio (HAR) structure etch
High dielectric material etch rate, multiple functions for etch uniformity tuning
Synchronized dual-level RF pulsing system
Higher chamber flow conductance design for wider etch stop window
Low-cost solution for middle and high aspec