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Primo TSV

AMEC's Primo TSV200E™ is a compact, ultra high-productivity etch tool for 200mm wafer-level packaging, MEMS and 3DIC applications. It leverages advanced etch technologies found in AMEC's Primo D-RIE™ and Primo AD-RIE™ tools, and delivers a 30 percent capital efficiency gain over other TSV etchers on the market.

3DICs are essential enablers of the tiny System-on-Chip (SOC) packages that today's CMOS image sensors, LEDs, MEMS and other devices depend on. The new stacking approach became imperative as transistor feature sizes shrank. The smaller features complicated voltage scaling and forced trade-offs between power and performance. By stacking the die, interconnects are shorter than traditional wire bonding. This enables increased package densities, faster data transfer or processor speed and lower power consumption – all in a smaller form factor.

Central to the Primo TSV200E tool is a dual-station chamber architecture that enables single-or dual-wafer processing. This configuration can be extended to accommodate up to three dual-station process modules. When compared to competitors’ single-station chamber tools, this unique feature nearly doubles wafer throughput potential while cutting process costs. A de-coupled high-density plasma source and bias increases etch rates at lower pressures and enables high process control flexibility over a wide process window. Also driving etch rate and uniformity improvements is a proprietary gas delivery design that optimizes process performance in the entire process regime, while an RF pulsing bias capability eliminates profile notching.

For more information on the Primo TSV200E, please email info@amecnsh.com