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AMEC SHIPS ADVANCED ETCH TOOL FOR 3D V-NAND FLASH PROCESSING TO LEADING SOUTH KOREAN MANUFACTURER OF MEMORY DEVICES
Customer will use Primo SSC AD-RIE™ system in
leading-edge pilot production line
SHANGHAI, China and SAN FRANCISCO, Calif., July 8, 2015—Advanced Micro-Fabrication Equipment Inc. (AMEC) today announced that a Primo SSC AD-RIE™ (single-station chamber) system was recently shipped to a leading manufacturer of memory ICs in South Korea. This is AMEC’s most advanced dielectric Etcher. It was designed to process critical Etch applications at nodes as low as 1xnm. The customer is already using the SSC AD-RIE system in high-volume production to process critical Etch applications at the 16nm node. The new tool will be installed in their pilot production line for 3D V-NAND flash devices.
The rapid migration to mobile electronics, and the growing richness of applications like data streaming and social media, is raising new performance imperatives for memory capacity and speed. The escalating demands are fast outstripping the capabilities of current-generation 2D NAND processing. 3D V-NAND represents the next process frontier, and AMEC’s customer is a leader in the transition. The technology addresses problems like data corruption and photolithography patterning limitations that make it difficult to move 2D NAND manufacturing to the next design node. 3D V-NAND benefits include greater capacity, higher speed, increased power efficiency, improved reliability, and lower production costs.
“Recognizing that 3D V-NAND flash was the future of memory processing, we dedicated considerable R&D resources and worked closely with this customer to develop the essential Etch technology for this high-end manufacturing process,” said KI Yoon, VP and GM for AMEC’s Key Memory & Logic Group. “Winning a place on this leading manufacturer’s 3D V-NAND pilot production line is a tribute to our joint effort. Furthermore, in this highly competitive space with just a few tier-one Etch suppliers, we believe that the quality of our process and our fast response to tough technical challenges helped us secure the order. We’re pleased and proud to enable the process for this valued customer.”
The Primo SSC AD-RIE tool was designed to provide a high-flow and low-pressure process regime with high ion energies for high aspect ratio contact applications. It’s the newest-generation tool in AMEC’s Primo dielectric Etch family. Like all AMEC tools, it was built to deliver advanced technology capabilities with ultra-high productivity and low cost-of-ownership advantages.
AMEC executives will be present at SEMICON West in San Francisco next week, July 14-16. The annual conference and tradeshow is the premier gathering for those involved in the global semiconductor equipment industry.
For more information about the SSC AD-RIE system or other AMEC tools, please visit www.amec-inc.com.
About Advanced Micro-Fabrication Equipment Inc. (AMEC)
AMEC is China’s leading provider of advanced process technology to global semiconductor manufacturers and others in adjacent energy-related sectors. The company is an entrenched supplier of dielectric and TSV Etch tools, helping tier-one customers build devices at process nodes as low as 1xnm. Today, AMEC has positioned more than 400 process units at 33 leading-edge fabs across Asia. Also, with its MOCVD tool, the company helps solid-state-lighting manufacturers build today’s most advanced LED products. To learn more about AMEC, please visit www.amec-inc.com.